| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| XC3S500E-4PQG208I | 单片机MCU |
XILINX/赛灵思 |
BGA208 |
22+ |
3903 |
|||
| EL7457CSZ-T7 | RENESAS/瑞萨 |
SOIC16 |
2231 |
2524 |
||||
| SI8233AB-D-IMR | SKYWORKS/思佳讯 |
LGA-14 |
2218 |
9903 |
||||
| LT3663EMS8E#TRPBF | 电源IC |
ADI/亚德诺 |
MSOP8 |
2210 |
106 |
|||
| ADM809-5SARTZ-RL7 | IC |
ADI/亚德诺 |
SOT-23 |
2328 |
13206 |
|||
| HMC533LP4E | 其他被动元件 |
ADI/亚德诺 |
VQFN24 |
2135 |
485 |
|||
| STM8S103F3U6TR | IC |
ST/意法 |
QFN20 |
2336 |
18000 |
|||
| 72V245L15TFGI | 存储IC |
IDT |
QFP64 |
2108+ |
128 |
|||
| MAX491MJD | MAXIM/美信 |
CDIP |
18+19+ |
1643 |
||||
| TLC542CN | 转换器IC |
TI/德州仪器 |
DIP20 |
10+ |
6151 |
|||
| OPA658UB | BURR-BROWN |
SOP8 |
0439 |
221 |
||||
| AGL1000V2-FGG256I | IC |
MICROCHIP/微芯 |
FPBGA256 |
23+ |
2606 |
|||
| X4C30F1-30SR | ANAREN/安伦 |
SMD |
1921 |
3609 |
||||
| NDY2409C | 模块 |
MURATA/村田 |
DIP24 |
2021 |
38 |
|||
| 88E1512-A0-NNP2C000 | IC |
MARVELL/迈威 |
QFN56 |
2152 |
32 |
|||
| TRP6-12 100,5 | IC |
EMC/杰力 |
SMD |
2017 |
356 |
|||
| LM124J | 其他被动元件 |
NS/美国国半 |
CDIP14 |
1532 |
145 |
|||
| HMC576LC3B | 其他被动元件 |
HITTITE |
LC3 |
22+ |
12 |
|||
| TA0763A | TAI-SAW |
SMD |
24+ |
785 |
||||
| HMC199MS8ETR | 工控元件 |
HITTITE |
MS8 |
17+ |
142 |
商家默认展示20条库存